# AI 消耗了全球多少先进芯片封装和 HBM？几乎全部。

- 来源：Epoch AI (@EpochAIResearch)
- 发布时间：2026-03-13 04:57
- AIHOT 链接：https://aihot.virxact.com/items/cmnw1yqib00rpslc3w9kf442o
- 原文链接：https://x.com/EpochAIResearch/status/2032199282737234162

## AI 摘要

2025 年四大 AI 芯片设计公司消耗全球约 90% 的先进封装和 HBM 供应，这些关键输入已成为行业瓶颈。AI 几乎垄断了全球先进芯片封装与高带宽内存产能。

## 正文

How much of the world's advanced chip packaging and high-bandwidth memory does AI consume？ Almost all of it.

We estimate the four largest AI chip designers consumed ~90% of global advanced packaging and HBM supply in 2025， suggesting these inputs were bottlenecks in 2025.