SemiAnalysis@SemiAnalysis_ · XIntel的EMIB封装技术被外部客户如Google的TPU采用，但Intel自身产品正转向UCIe技术。Diamond Rapids预计使用UCIe over substrate实现长距离die-to-die互连。在ISSCC上，Intel展示了UCIe-S D2D链接，在22nm工艺下达到48 Gb/s/lane，距离达30mm，数据率和带宽密度优于3nm设计。substrate配置为5-2-5，而EMIB为11-2-11。由于substrate短缺，Intel的“最佳”封装技术对除Intel外的客户更具优势。
While Intel gains external customers using EMIB - Google's TPU being the big one - they're moving away from it for their own products. Diamond Rapids will likely use UCIe over substrate for a long-reach die-to-die interconnect instead.
At ISSCC， Intel showed a UCIe-S D2D link on 22nm hitting 48 Gb/s/lane over standard organic substrate at a reach of up to 30 mm. Beat a 3nm design with 3× higher data rate and 2.8× higher bandwidth density.
5-2-5 substrate vs 11-2-11 on EMIB. With substrate in short supply， Intel's "best" packaging tech - for everyone but Intel.