# 封装与架构创新突破硬件限制

- 来源：Rohan Paul (@rohanpaul_ai)
- 发布时间：2026-05-24 18:29
- AIHOT 分数：54
- AIHOT 链接：https://aihot.virxact.com/items/cmpjnye3w00onslxdnozwzl7k
- 原文链接：https://x.com/rohanpaul_ai/status/2058495494490558847

## AI 摘要

华为在先进NAND芯片受限的背景下，未直接追赶三星主导的高层数堆叠技术，而是采用“Die-on-Board”封装方案，通过将NAND裸片直接安装在电路板上提升存储密度，推出122.88TB AI SSD并计划推出245TB版本。与此同时，DeepSeek通过MoE、CSA/HCA等架构优化，大幅降低模型对HBM和算力的依赖，使国产硬件更适配前沿AI需求。两者路径形成呼应：华为从封装层面绕过芯片性能差距，DeepSeek从算法层面缓解硬件稀缺压力，共同体现了在外部限制下通过底层技术创新开辟新赛道的战略思维。

## 正文

🇨🇳 🇺🇸 China's Huawei's new 122TB SSD shows how export controls can move innovation sideways instead of simply stopping it.

Huawei just built a 122.88TB AI SSD by changing the package around the memory， not by matching Samsung's most advanced 400+ layer 3D NAND.

And a 245TB version discussed as a future step.

High-capacity SSDs usually grow by stacking more NAND layers inside each chip， but Huawei's access to those chips is blocked because its Entity List status restricts items tied to US technology.

So it is not trying to win only by making taller 3D NAND stacks， where Samsung has already shown 400-plus-layer V-NAND work.

Instead， Huawei is shifting the contest from the chip itself to the way chips are packed together.

Huawei's workaround is Die-on-Board， which puts NAND dies directly onto the circuit board， cuts out some normal chip packaging， and raises board-level density by packing more lower-density memory into the same device.

Direct die placement creates heat and signal problems， but it shows how packaging can recover some of the capacity lost when a company cannot buy the best memory chips.

### 引用推文

> Rohan Paul：Great article here on DeepSeek. Their real story is not cheaper chatbots, but architecture that turns hardware scarcity into strategy. DeepSeek is not trying to...