# 内存成本已占到人工智能芯片总成本的近三分之二

- 来源：Hacker News 热门（buzzing.cc 中文翻译）
- 作者：intelkishan
- 发布时间：2026-05-25 02:40
- AIHOT 分数：58
- AIHOT 链接：https://aihot.virxact.com/items/cmpk53sna0456sl01cw0z41rx
- 原文链接：https://epoch.ai/data-insights/ai-chip-component-cost-shares

## AI 摘要

根据 epoch.ai 的数据，内存成本在AI芯片总成本中的占比已显著增长，目前接近三分之二。这一数据表明，在构建AI系统所需的硬件成本结构中，内存组件的重要性日益凸显，其成本占比已成为主要部分。该趋势反映了当前AI芯片发展过程中，对高速、大容量内存的依赖与需求正在不断加强。

## 正文

High-bandwidth memory (HBM) has grown from 52% to 63% of total AI chip component spending between Q1 2024 and Q4 2025. These estimates are an average across all AI chips designed by Nvidia, AMD, Google, and Amazon, weighted by production volume. As a share of spend, logic dies stayed roughly flat near 13%, while advanced packaging fell from 19% to 15% and auxiliary components fell from 15% to 9%. In absolute terms, HBM spend across these four designers grew from roughly $12 billion in 2024 to $32 billion in 2025, a faster year-over-year increase than any other component.

HBM will likely account for an even larger share in 2026 as memory supply remains tight and prices rise. Hyperscalers are already anticipating this in capex guidance: Microsoft’s $190 billion FY2026 capex outlook includes about $25 billion from higher component prices, while Meta raised its 2026 capex range by $10 billion, citing higher component prices.

Epoch's work is free to use, distribute, and reproduce provided the source and authors are credited under the Creative Commons BY license.

Learn more about this graph

For each AI chip designed by Nvidia, AMD, Google, and Amazon, we estimate the per-chip cost of four component categories: memory (HBM), logic dies, advanced packaging (CoWoS), and auxiliary components. We then multiply those per-chip costs by estimated quarterly production volumes to get total component spending in each category, and compute each category’s share of total component spending per quarter from Q1 2024 to Q4 2025.

We find that memory’s share rose from 52% to 63% over this period, while packaging fell from 19% to 15% and auxiliary components from 15% to 9%. Logic die share stayed roughly constant near 13–14%. Total component spend on AI chips grew from approximately $22 billion in 2024 to $52 billion in 2025, with HBM spending alone accounting for roughly $20 billion of that increase.

Data

Component cost estimates are drawn from our AI Chip Components explorer, which builds chip-level bills of materials from financial disclosures, supplier filings, and analyst reports. Four component categories are tracked:

Memory: HBM stacks (HBM3, HBM3e).

Logic: advanced-node logic dies (3 - 5nm).

Packaging: TSMC CoWoS advanced packaging.

Auxiliary: substrate, power delivery, and other non-logic, non-memory inputs.

See the explorer’s methodology documentation to learn more.

Analysis

Each unit of a component has some cost uncertainty, including the price of an HBM stack, a logic die, or a CoWoS package. We model each chip’s per-component cost with a 90% confidence interval and the share is a ratio of this component’s cost over the total, so both numerator and denominator are uncertain. We show two bounds on the share:

Range from this component’s cost: the share when this component’s cost lands at its 5th or 95th percentile and the other three components are held at their medians.

Range when all components vary at extremes: the share when this component sits at one extreme of its CI and every other component lands simultaneously at the opposite extreme of theirs.

Q1 2024:

ComponentShareRange from this component’s costRange when all components vary at extremesMemory52%48 - 56%42 - 62%Logic14%12 - 17%10 - 20%Packaging19%14 - 24%12 - 27%Auxiliary15%13 - 18%11 - 21%

Q4 2025:

ComponentShareRange from this component’s costRange when all components vary at extremesMemory63%60 - 67%54 - 73%Logic13%10 - 16%9 - 19%Packaging15%11 - 19%9 - 22%Auxiliary10%8 - 10%7 - 12%

Assumptions and limitations

Component costs can vary by contract, supplier, and timing, so our per-chip estimates carry some uncertainty. Our estimates of the number of chips produced each quarter and the chip-type mix also carry uncertainty, both of which propagate into the shares we report.

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Epoch AI’s work is free to use, distribute, and reproduce provided the source and authors are credited under the Creative Commons Attribution license.

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Memory has grown to nearly two-thirds of AI chip component costs

High-bandwidth memory (HBM) accounts for 63% of AI chip component costs, up from 52% in Q1 2024. Epoch AI's breakdown of component cost shifts across major chip designers.