# 华为无法获得EUV，于是制定了自己的缩放定律。

- 来源：Chubby♨️ (@kimmonismus)
- 发布时间：2026-05-25 17:01
- AIHOT 分数：73
- AIHOT 链接：https://aihot.virxact.com/items/cmpl078j50bposl01tr1ckgrs
- 原文链接：https://x.com/kimmonismus/status/2058835932975915191

## AI 摘要

华为在IEEE ISCAS上公布了Tau（τ）Scaling Law框架，通过时间维度优化替代传统的晶体管几何尺寸微缩。公司六年内设计量产了381款芯片，采用新LogicFolding架构的麒麟芯片将于今年秋季出货。其目标是到2031年，实现等效于1.4nm工艺的晶体管密度，而无需依赖受ASML禁运影响的EUV光刻技术。这一基于架构创新的路径若成功，将削弱美国出口管制的效力。

## 正文

Chinas Huawei can't access EUV. So they wrote their own scaling law. The leverage of US export controls erodes.

Huawei just presented the Tau （τ） Scaling Law at IEEE ISCAS， a framework that replaces geometric transistor scaling with time-based optimization across devices， circuits， chips， and systems.

Huawei is not trying to win the nanometer race anymore. They're redefining it.

381 chips designed and mass-produced over six years. Kirin chips with their new LogicFolding architecture ship this fall. Target by 2031： transistor density equivalent to 1.4nm processes - without EUV （ASML embargo still hits hard）

Whether Tau Scaling delivers on that promise remains to be seen. But it shows one thing： US export controls cut Huawei off from cutting-edge lithography， and instead of hitting a wall， they built a parallel road.

China's semiconductor independence isn't hypothetical anymore. It's shipping in phones， running AI workloads， and now has its own scaling law presented at one of the world's top circuit design conferences.

If Huawei can close the performance gap through architecture instead of lithography， the entire leverage of US export controls erodes. The sanctions were designed to keep China two generations behind. Huawei is trying to make that metric irrelevant.

h/t @AndrewCurran_ for finding this interesting blogarticle and @zephyr_z9 for the photo

### 引用推文

> Andrew Curran：Huawei says it has made a breakthrough and expects to design high-end chips with transistor density equivalent to 1.4 nm processes by 2031.