SemiAnalysis@SemiAnalysis_ · XAI 摘要
Cerebras做到了业界认为不可能的事：将整个46,225mm²晶圆制成单芯片。如此大面积的硅片缺陷不可避免，因此他们内置了冗余，并采用定制的逐批次光罩来绕过每个不良核心，最终实现了接近100%的可用晶圆率。结果：单片硅片上集成了90万个核心和44GB SRAM，无需封装，无片外跳转。他们并未止步于此，目前正在探索将DRAM晶圆通过混合键合堆叠在上方，以获得更快的更多内存。(1/4) 🧵
Cerebras did what the industry calls impossible： turned an entire 46，225mm2 wafer into one chip. Defects on silicon that big are inevitable， so they built in redundancy and custom per-batch masks that route around every bad core， landing near 100% usable wafers. The results： 900，000 cores and 44GB of SRAM on a single piece of silicon， no packaging， no off-chip hops. And they're not stopping there， now exploring hybrid bonding a DRAM wafer on top for even more fast memory. （1/4） 🧵