AI 摘要
垂直功率传输、柔性移动引脚中介层和直接冲击水冷。Cerebras 不得不重写机械工程手册,仅仅是为了防止单个晶圆自裂。
Vertical power delivery, flexible moving-pin interposers, and direct-impingement water cooling. Cerebras had to rewrite the mechanical engineering playbook just to keep a single wafer from cracking itself apart.