郭明錤最新调查显示,联发科将AI业务从“IC/ASIC设计”升级为“系统级设计”,初期目标Google TPU v10的PCBA(L6)及马斯克关联公司自研AI芯片的L10机架。此举旨在抓住服务器机架复杂度提升(CPO、800V HVDC)带来的增值机会,并应对2-3年后Semi-COT对ASIC设计的冲击。联发科将采用轻资产模式,主导设计验证并外包制造,以维持40-50%毛利率。Google TPU L10中选几率低;马斯克AI芯片机架生态尚未成熟,联发科可借台湾供应链和Terafab合作争取订单,但时间表不明确。该战略对近两年基本面影响有限,旨在捕捉长期新增长。
My latest industry checks indicate that MediaTek has upgraded the strategic positioning of its AI business from "IC / ASIC design" to "system-level design," initially targeting the PCBA (L6) for Google's TPU and the L10 rack for Elon Musk-affiliated companies' in-house AI chips.
Overall, this strategic shift aligns with industry trends and, if executed well, should help strengthen MediaTek's customer relationships and long-term competitive advantage.
Industry checks and analysis: