郭明錤｜Ming-Chi Kuo@mingchikuo

2026-06-18 10:45·15天前

AI 摘要

台积电在JPCA Show 2026公开玻璃核心基板，与Ibiden、Innolux合作，采用玻璃芯夹两层ABF的三层结构，用于CoPoS的“oS”部分。基板单位成本数倍于现有ABF，Innolux处理的玻璃最贵。客户包括Nvidia和两家美国公司。验证显示其解决了力学与电学难题，显著改善电源完整性。目前切割自250×250mm基板，ABF层24-28层，对应2027–2028年AI芯片主流规格。CoW测试车辆已验证复合材料机械结构瓶颈已突破。

Breaking down TSMC's glass core substrate slide

On June 11， at JPCA Show 2026 in Japan， TSMC gave a roughly 40-slide presentation titled "Advanced Packaging Technology Essential to the Evolution of AI" （AIの進化に不可欠な先端パッケージング技術）. One slide from the deck， titled "Glass Substrate Development for CoWoS，" has since leaked online and widespread attention.

Here's a closer read of that slide （see attached image）. I'll skip the technical background that is already widely available. One thing to flag： the "COP" on the slide does not stand for Chip-on-Package. It means Coplanarity.

▌ Key conclusions：

TSMC has officially announced a partnership with Ibiden and Innolux to develop a glass core substrate. The structure is a three-layer design， a glass core sandwiched between two ABF build-up layers. This is the "oS" in CoPoS.

The market underestimates how important the glass core substrate is. It's a must-have capability for TSMC. In other words， within CoPoS the "oS" matters more than the "CoP"， which is also why， when it was tested， it was paired with the existing CoW rather than with CoP.

The glass core substrate costs several times more per unit than existing ABF substrates. The glass processed by Innolux is very expensive per unit and is the single most critical material. Besides Nvidia， two US-based customers have also expressed strong interest.

▌ Industry checks tied to this slide：

The glass core substrate shown on the slide is cut from a full-size 250×250mm one. The ABF build-up layers mainly use Ajinomoto's GL107， mixed with ABF-GCP， and were tested at 24-28 layers， which is the mainstream ABF spec for AI chips in 2027-2028.

The CoW used in TSMC's experiment is a test vehicle. It is sufficient to validate the most challenging mechanical-structure issues that arise when working with composite materials. Good results mean TSMC， Ibiden， and Innolux have together broken through the critical technical bottleneck.

郭明錤｜Ming-Chi Kuo@mingchikuo · X

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2026-06-18 10:45·15天前

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AI 摘要

Breaking down TSMC's glass core substrate slide

▌ Key conclusions：