Chubby♨️@kimmonismus · XIBM 发布世界首个次纳米节点芯片技术突破——0.7nm（7埃）工艺，采用 3D "纳米堆栈" 晶体管架构实现垂直堆叠交错。该技术可在指甲盖大小的芯片上集成近 1000 亿个晶体管，密度约为 2021 年 2nm 芯片的两倍。相比前代，性能可提升 50% 或能效提升 70%，SRAM 缩放达 40% 以适配 AI 工作负载。IBM 强调目前仍为研究阶段，量产最早可能在未来 5 年内实现。
IBM just unveiled a sub-1 nanometer chip breakthrough.
That honestly wasnt on my bingo card.
Its new 0.7 nm / 7 angstrom technology uses a 3D "nanostack" transistor architecture to vertically stack and stagger transistors.
IBM says it can fit nearly 100 billion transistors onto a chip the size of a fingernail， almost 2x the density of its 2 nm chip from 2021.
• up to 50% more performance • or 70% better energy efficiency • 40% SRAM scaling for AI workloads
Important caveat： this is still research， not a chip shipping tomorrow. IBM says production could happen as early as the next 5 years.