AI 摘要
Etched 发布 Cluster-Scale Memory(CSM),面向低延迟工作负载。现有 AI 芯片使用 HBM 无法达到 SRAM 级解码速度,纯 SRAM 芯片则 FLOPs 密度和容量不足。CSM 在整个扩展域内创建共享低延迟内存池,采用专有超低延迟高带宽互连,以 HBM/SRAM 混合设计同时解决内存容量与芯片间延迟问题,避免了纯 SRAM、3D DRAM 或光学方案在成本、可靠性、良率、散热和算力上的取舍。
etched cluster-scale memory has so many SerDes
Introducing Cluster-Scale Memory (CSM) for low latency workloads. Today's AI chips using HBM can't achieve SRAM-level decode speeds due to memory subsystem and ...