SemiAnalysis@SemiAnalysis_ · XAI 摘要
Google 下一代 TPU（代号 Humufish）确认采用 Intel 的 EMIB-T 封装方案，而非行业默认的 TSMC CoWoS。目前几乎所有主流 AI 训练加速器都使用 TSMC 2.5D 流程，其中绝大部分是 CoWoS。CoWoS 技术将所有芯片放置在一块大型硅/重分布层（RDL）中介层上；而 Intel 的 EMIB 则仅在需要芯片间连接的位置嵌入小型硅桥，直接集成到有机基板中。这是旗舰级 AI 芯片首次脱离 CoWoS 生态，值得关注。
Google's next TPU， codenamed Humufish， is set to use Intel's EMIB-T instead of TSMC CoWoS.
Nearly every leading AI training accelerator today is packaged on a TSMC 2.5D flow， and almost all of it is CoWoS. CoWoS is the industry default， which is exactly why a flagship part moving off it is worth attention.
The core difference. CoWoS places all dies on a single large silicon/RDL interposer. EMIB embeds small silicon bridges directly in the organic substrate， only where die-to-die links are needed. （1/4）🧵