# JEDEC发布SPHBM4标准，打破AI封装瓶颈

- 来源：SemiAnalysis (@SemiAnalysis_)
- 发布时间：2026-07-03 21:30
- AIHOT 分数：55
- AIHOT 链接：https://aihot.virxact.com/items/cmr4zg8lo06gwsll53qfg1mit
- 原文链接：https://x.com/SemiAnalysis_/status/2073036634094784720

## AI 摘要

上周，JEDEC公布了SPHBM4（标准封装高带宽内存，JESD330-4）新标准。

该标准采用与HBM4相同的DRAM堆栈，但换用不同的缓冲芯片。目标？在标准封装中实现HBM组装，打破AI先进封装瓶颈。(1/6)🧵

## 正文

This last week JEDEC announced a new standard for SPHBM4: Standard Package High Bandwidth Memory (JESD330-4).

It utilizes the same DRAM stacks as HBM4, but swaps in a different buffer die. The goal? Enable HBM assembly in standard packaging and break the AI Advanced Packaging bottleneck. (1/6)🧵