# 华为麒麟9030金属间距超越Intel 18A

- 来源：SemiAnalysis (@SemiAnalysis_)
- 发布时间：2026-07-21 01:06
- AIHOT 分数：60
- AIHOT 链接：https://aihot.virxact.com/items/cmrthp7bk3c0fbitlkg4wj3lz
- 原文链接：https://x.com/SemiAnalysis_/status/2079251630608842814

## AI 摘要

SemiAnalysis拆解华为麒麟9030芯片，电子显微镜测量显示其最小金属间距仅32.5纳米，比Intel全新18A节点（Panther Lake）的金属间距还要小约10%。这一结果意味着，在没有EUV光刻机的情况下，中国晶圆厂在布线密度上已超越Intel的先进EUV节点。

## 正文

We cut open the Kirin 9030 and put it under an electron microscope.
The smallest metal pitch measures 32.5 nanometers. That is tighter than Intel 18A， their brand new leading edge node.

A Chinese fab with no EUV is out-pitching Intel's EUV node by roughly 10 percent. What's going on here？ 🤯

"This is the HiSilicon Kirin 9030， the chip inside Huawei's newest flagship phone. A few weeks ago， we cut it open， put it under an electron microscope， and measured the smallest wires inside the chip， the metal pitch. And what we saw was unexpected. The smallest metal pitch inside the Kirin 9030 measures only 32.5 nanometers. That's smaller than the metal pitch in Panther Lake， which is based on Intel's brand-new 18A node.

A Chinese fab， cut off from the most advanced tools， without EUV， is packing its wires about ten percent tighter than Intel's leading edge EUV node. What's going on here？"