# SemiAnalysis：MI455 为首款搭载主动式 LSI 桥接的芯片

- 来源：SemiAnalysis (@SemiAnalysis_)
- 发布时间：2026-08-04 10:00
- AIHOT 分数：47
- AIHOT 链接：https://aihot.virxact.com/items/cmse0nads088uro2eri2mduth
- 原文链接：https://x.com/SemiAnalysis_/status/2084459410265411615

## AI 摘要

SemiAnalysis 认为 MI455 是首款搭载主动式本地硅互连（LSI）桥接的芯片，用于 CoWoS-L 封装内的 chiplet 间连接。TSMC 在 ISSCC 2026 展示了带低功耗中继器的主动桥接，可分担信号完整性负担，使顶层 die 的 PHY 显著缩小。

## 正文

We believe the MI455 is the first known chip to ship with active Local Silicon Interconnect （LSI） bridges， the chiplet-to-chiplet links inside a CoWoS-L package.

In CoWoS-L's short history， those bridges have always been passive： wiring and capacitors， nothing more. Active LSIs carry real circuitry. At ISSCC 2026， TSMC demoed active bridges with a low-power repeater that regenerates signals mid-channel.

Why it matters： once the bridge shares the signal-integrity burden， the PHYs on the top dies can shrink meaningfully at near-zero energy cost， reclaiming leading-edge silicon and shoreline for compute and memory.

The giveaway that this is a shipping product rather than a research vehicle： the interposer TSMC showed matches the MI455 exactly. Two base dies， twelve HBM4 stacks， two IO dies.