The foundry industry hit a record $54.5B in 2Q26 (+28% y/y, 10th straight growth quarter) with almost none of it coming from new capacity. Supply rose just 6% y/y, so pricing and mix did the work, N2 and advanced packaging at the leading edge, and the first broad mature-node price increases since the COVID cycle at the trailing edge. Demand keeps tilting toward AI. HPC hit a record 66% of TSMC revenue while smartphone dropped to 22%. Utilization jumped to 90% from 85% as the recovery finally reached non-China mature fabs. TSMC still took 90% of the $30.1B gross profit pool at 73.8% revenue share, but the story underneath is ex-TSMC growth doubling to +14% in 2026 from +3% in 2025 on the pricing turn. 3Q26E accelerates to $61.4B (+34% y/y), the fastest of this cycle. (1/6)🧵
晶圆代工行业Q2营收创纪录545亿美元
AI 导读
晶圆代工行业2Q26营收达545亿美元,同比增长28%,连续第十个季度增长,但新增产能仅增6%,增长主要来自涨价和产品组合优化。台积电HPC营收占比达66%创纪录,智能手机降至22%,产能利用率从85%升至90%。3Q26E预计达614亿美元,同比增长34%,为周期内最快增速。
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AI 编辑部评分,满分 100晶圆代工行业Q2营收创纪录545亿美元
晶圆代工行业2Q26营收达545亿美元,同比增长28%,连续第十个季度增长,但新增产能仅增6%,增长主要来自涨价和产品组合优化。台积电HPC营收占比达66%创纪录,智能手机降至22%,产能利用率从85%升至90%。3Q26E预计达614亿美元,同比增长34%,为周期内最快增速。
来源:SemiAnalysis· x.com